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[Barcelona, Spain, October 23, 2018] The industry-leading “Time-Sensitive Networking (TSN) + OPC Unified Architecture (OPC UA)” Testbed including six main industrial interconnection scenarios was exhibited for three days at the world's largest IoT summit – IoT Solution World Congress. The testbed was built by many international organizations and world-renowned manufacturers including Alliance of Industrial Internet (AII), Avnu Alliance, Edge Computing Consortium (ECC), Fraunhofer FOKUS, Huawei, Schneider Electric, HollySys, National Instruments (NI), ABB, B&R, TTTech, Spirent, Moxa, Phoenix Contact, and Renesas Electronics. This testbed is an evolution of that released at the Hanover MESSE, expanding to 30 members.
Huawei Expert Introduce TSN+OPC UA Open Network
TSN+OPC UA open network converges ICT and OT technologies and will become an important foundation for the construction of the Industrial Internet. In addition, it is the key technology to strengthen the industrial infrastructure capabilities proposed by "Made in China 2025", promote intelligent manufacturing, and enhance the digitalization, networking, and intelligence of manufacturing. TSN+OPC UA meets the high-security, real-time and high-reliability requirements of industrial production. It does this by providing a real-time, highly deterministic, and truly open interconnected communication network, compensating for disadvantages of traditional real-time industrial Ethernet when it comes to usability, interoperability, bandwidth, and equipment costs. What’s more, through a smarter and more efficient network, the manufacturing industry can share resources, data, models and methods in the fields of big data, mobile Internet, artificial intelligence (AI), among others, and realize the transformation and upgrading of the industry.
At present, the TSN+OPC UA network jointly created by multiple parties supports unified SDN management. It also supports real-time software container environment and high-precision clock (supports 802.1AS and 1588v2 for fast TSN scheduling of <8ns), achieving microsecond-level low latency and nanosecond-level jitter. In addition, 1G bandwidth is achieved, with evolution to 10G/100G TSN supported. The TSN+OPC UA network also implements OPC UA Pub/Sub low-latency lightweight protocol stack to meet the interaction requirements of real-time control communication, and prioritize needs at precise times, ensuring real-time and non-real-time data is transmitted simultaneously and realizing the "one network" concept of machines, people, and objects.
TSN+OPC UA Open Network won the world's top ten technological innovation awards for smart manufacturing on October 11th, 2018, at the "2018 World Intelligent Manufacturing Conference" jointly organized by the People's Government of Jiangsu Province, the Ministry of Industry and Information Technology, the Chinese Academy of Engineering, and the China Association for Science and Technology.
TSN+OPC UA Open Network won the world's top ten technological innovation awards
In the future, Huawei will unite more international organizations and manufacturers to actively promote the industry implementation of TSN+OPC UA by building intelligent manufacturing TSN demonstration production lines around the world, and accelerate the intelligent manufacturing through deep integration and innovation of OT and ICT technologies, finally culminating in the industrial Internet.